Study of Thermal Stability of Ultrafine-Grained Copper by means of Electron Back Scattering Diffraction

MATERIALS TRANSACTIONS

Man, O; Pantelejev, L; Kunz, L, 2010: Study of Thermal Stability of Ultrafine-Grained Copper by means of Electron Back Scattering Diffraction. MATERIALS TRANSACTIONS 51(2), p. 209 - 213, doi: 10.2320/matertrans.MC200909

Research Groups:

• Advanced Instrumentation and Methods for Materials Characterization - Jozef Kaiser

CEITEC authors:

• Ondřej Man, Ph.D.