RIE by Chlorine Chemistry Oxford Instruments Plasma Technology PlasmaPro 100 (RIE-CHLORINE)
Guarantor:
Marek Eliáš, Ph.D.
Technology / Methodology:
Etching & Deposition
Instrument status:
Operational, 28.4.2021 14:33
Equipment placement:
CEITEC Nano - C1.34
Research group:
CF: CEITEC Nano
Detailed description:
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.
A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few millitorr and a few hundred millitorr by adjusting gas flow rates and/or adjusting an exhaust orifice.
Publications:
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GABLECH, I.; KLEMPA, J.; PEKÁREK, J.; VYROUBAL, P.; HRABINA, J.; HOLÁ, M.; KUNZ, J.; BRODSKÝ, J.; NEUŽIL, P., 2020: Simple and efficient AlN-based piezoelectric energy harvesters . MICROMACHINES 11(2), p. 1 - 10, doi: 10.3390/mi11020143; FULL TEXT
(DRIE, RIE-CHLORINE, WIRE-BONDER, KAUFMAN) -
GABLECH, I.; BRODSKÝ, J.; PEKÁREK, J.; NEUŽIL, P., 2020: Infinite selectivity of wet SiO2 etching in respect to Al . MICROMACHINES 11(4), p. 365 - 7, doi: 10.3390/mi11040365; FULL TEXT
(EVAPORATOR, SUSS-MA8, RIE-CHLORINE, DWL, SUSS-RCD8) -
GABLECH, I.; KLEMPA, J.; PEKÁREK, J.; VYROUBAL, P.; KUNZ, J.; NEUŽIL, P., 2019: Aluminum nitride based piezoelectric harvesters. 2019 19TH INTERNATIONAL CONFERENCE ON MICRO AND NANOTECHNOLOGY FOR POWER GENERATION AND ENERGY CONVERSION APPLICATIONS (POWERMEMS) (001), p. 1 - 4, doi: 10.1109/PowerMEMS49317.2019.82063211368; FULL TEXT
(DIENER, DRIE, DWL, KAUFMAN, RIE-CHLORINE, SUSS-MA8) -
HRDÝ, R.; PRÁŠEK, J.; FILLNER, P.; VANČÍK, S.; SCHNEIDER, M.; HUBÁLEK, J.; SCHMID, U., 2019: Development of HfO2/Al2O3 Stack for On-Chip Capacitor Applications
. INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY ISSE , p. 1 - 4, doi: 10.1109/ISSE.2019.8810156; FULL TEXT
(ALD, SUSS-MA8, EVAPORATOR, SUSS-RCD8, DWL, RIE-CHLORINE) -
Brodský, J., 2019: Characterization of graphene elecrical properties on MEMS structures. BACHELOR´S THESIS , p. 1 - 50
(MPS150, WITEC-RAMAN, EVAPORATOR, DRIE, PECVD, DWL, SUSS-MA8, RIE-FLUORINE, RIE-CHLORINE, DIENER, SCIA)