RIE by F Chemistry and PECVD of hard C-based films Oxford Instruments Plasma Technology PlasmaPro 80 (RIE-FLUORINE)

RIE by F Chemistry and PECVD of hard C-based films Oxford Instruments Plasma Technology PlasmaPro 80
CONTACT US

Guarantor: Marek Eliáš, Ph.D.
Technology / Methodology: Etching & Deposition
Instrument status: Operational Operational, 20.7.2021 12:58
Equipment placement: CEITEC Nano - C1.34
Research group: CF: CEITEC Nano


Detailed description:

Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.
A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few millitorrs and a few hundred millitorrs by adjusting gas flow rates and/or adjusting an exhaust orifice.


Publications:

  • Sepúlveda, M.; Kamnev, K.; Pytlicek, Z.; Prasek, J.; Mozalev, A., 2021: Superhydrophobic–Oleophobic Visible–Transparent Antireflective Nanostructured Anodic HfO2 Multifunctional Coatings for Potential Solar Panel Applications. ACS APPLIED NANO MATERIALS 4(2), p. 1754 - 1765, doi: 10.1021/acsanm.0c03202; FULL TEXT
    (MAGNETRON, RIE-FLUORINE, VERIOS, JAZ3-CHANNEL)
  • Takhsha Ghahfarokhi, M.; Arregi, J. A.; Casoli, F.; Horký, M.; Cabassi, R.; Uhlíř, V.; Albertini, F., 2021: Microfabricated ferromagnetic-shape-memory Heuslers: The geometry and size effects. APPLIED MATERIALS TODAY 23, doi: 10.1016/j.apmt.2021.101058; FULL TEXT
    (VERSALAB, RIGAKU9, KERR-MICROSCOPE, SUSS-MA8, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, VERIOS)
  • Zadorozhnii, O., 2021: Exchange bias in metamagnetic heterostructures. MASTER´S THESIS , p. 1 - 81; FULL TEXT
    (MAGNETRON, VERSALAB, KERR-MICROSCOPE, RAITH, RIE-FLUORINE, LYRA, UHV-DEPOSITION, UHV-PREPARATION, UHV-XPS)
  • LEDNICKÝ, T.; BONYÁR, A., 2020: Large Scale Fabrication of Ordered Gold Nanoparticle-Epoxy Surface Nanocomposites and Their Application as Label-Free Plasmonic DNA Biosensors. ACS APPL MATER INTER 12(4), p. 4804 - 11, doi: 10.1021/acsami.9b20907; FULL TEXT
    (MAGNETRON, RIE-FLUORINE, VERIOS, LYRA, HELIOS, KRATOS-XPS)
  • Chmela, O., 2020: Progress toward the development of single nanowire-based arrays for gas sensing applications. PH.D THESIS , p. 1 - 199
    (ALD, DWL, KAUFMAN, DIENER, SUSS-MA8, SUSS-RCD8, RAITH, MAGNETRON, EVAPORATOR, RIE-FLUORINE, SCIA, DEKTAK, ICON-SPM, NANOCALC, MPS150, WIRE-BONDER)

Show more publications...